Process Control Applications

CTI has extensive experience in designing and optimizing process control applications, and in particular applications employing National Instruments Real-Time and FPGA hardware targets.  Click the links below to view more extensive descriptions of some of the custom applications we’ve developed or contact CTI to find out more.

• HFC Refrigerants Reactor - CTI has developed multiple custom software applications to control and monitor HFC refrigerant reactor pilot plants.  These high channel count systems employ NI cFP Real-Time hardware for the highest level of reliability.
   
• Watlow & Eurotherm Reactor Systems- CTI has developed numerous small reactor systems utilizing Watlow and Eurotherm controllers to control temperature, pressure, flow, and other parameters.
   
• Hot Dip Simulator - controls motion, heating, cooling and logs data from a 1/10th scale simulator of steel manufacturing facility.  Uses PID control to optimize heating of steel panels.
   
• Photocell Production System - controls the manufacture of photocells in a vacuum chamber.  User can create, edit, and load recipes which control temperatures, times, and gas pressures of various process phases.
   
• Semiconductor Deposition System - controls a vacuum deposition system used in producing optoelectronics.  The control software controls the deposition parameters via recipes, the vacuum system, and residual gas analyzer.
   
• Fillstand Control System - controls the filling and testing of ring laser gyroscopes.  Allows for the simultaneous processing of 16 gyros.
   
• Ethylene Oxide Reactor - compact FieldPoint Real-Time control and monitoring application for an EO pilot plant.
   
• Powder Feed Control System - controls the powder dispensing rate, heater temperature, and other functions of one or two powder feed controllers.
   
• Bio-Sample IR Analyzer - system with IR camera monitoring small temp changes in wellplates. System also controls gas mixture and pressure exposed to samples.
   
• Electroplating Control System - controls the electroplating process for semiconductor materials in a system that is easily expandable to include multiple electroplating tanks using just one computer to control the various electroplating stations.